التفاصيل البيبلوغرافية
| العنوان: |
An Analytical Model Describing Residual Stresses in Thin Die Attach Layer |
| المؤلفون: |
Assaad, Wissam, Smits, Edsger, Pranger, Ruben |
| المصدر: |
2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2024 25th International Conference on. :1-8 Apr, 2024 |
| Relation: |
2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) |
| قاعدة البيانات: |
IEEE Xplore Digital Library |
Full Text Finder