التفاصيل البيبلوغرافية
العنوان: |
Evaluation of warpage of FOWLP considering the viscoelastic and viscoplastic properties of Epoxy Molding Compound |
المؤلفون: |
Jalouli, Zahra, Maia, Wilson, Haidar, Noura, Serghei, Anatoli |
المصدر: |
2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2024 25th International Conference on. :1-4 Apr, 2024 |
Relation: |
2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) |
قاعدة البيانات: |
IEEE Xplore Digital Library |