Evaluation of warpage of FOWLP considering the viscoelastic and viscoplastic properties of Epoxy Molding Compound

التفاصيل البيبلوغرافية
العنوان: Evaluation of warpage of FOWLP considering the viscoelastic and viscoplastic properties of Epoxy Molding Compound
المؤلفون: Jalouli, Zahra, Maia, Wilson, Haidar, Noura, Serghei, Anatoli
المصدر: 2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2024 25th International Conference on. :1-4 Apr, 2024
Relation: 2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)
قاعدة البيانات: IEEE Xplore Digital Library
الوصف
ردمك:9798350393637
تدمد:28338596
DOI:10.1109/EuroSimE60745.2024.10491575