التفاصيل البيبلوغرافية
| العنوان: |
Photosensitive Polyimides Compositions with Good Flexibility and Low Dielectric Property for Heterogeneous Chiplet Integration Technologies |
| المؤلفون: |
Tasaki, Takashi, Yamaguchi, Takashi, Nakamura, Taiyou, Yamashita, Madoka |
| المصدر: |
2024 International Conference on Electronics Packaging (ICEP) Electronics Packaging (ICEP), 2024 International Conference on. :7-8 Apr, 2024 |
| Relation: |
2024 International Conference on Electronics Packaging (ICEP) |
| قاعدة البيانات: |
IEEE Xplore Digital Library |
