مؤتمر
Formation of SiO2 Bonding Interface using Perhydropolysilazane at Room Temperature
| العنوان: | Formation of SiO2 Bonding Interface using Perhydropolysilazane at Room Temperature |
|---|---|
| المؤلفون: | Takeuchi, Kai, Nemoto, Daiki, Suga, Tadatomo, Higurashi, Eiji |
| المصدر: | 2024 International Conference on Electronics Packaging (ICEP) Electronics Packaging (ICEP), 2024 International Conference on. :113-114 Apr, 2024 |
| Relation: | 2024 International Conference on Electronics Packaging (ICEP) |
| قاعدة البيانات: | IEEE Xplore Digital Library |
| ردمك: | 9784991191176 |
|---|---|
| DOI: | 10.23919/ICEP61562.2024.10535553 |