مؤتمر
Optimization of Ag Thin Film Thickness with a Capping Layer for Ag-Ag Surface Activated Bonding
| العنوان: | Optimization of Ag Thin Film Thickness with a Capping Layer for Ag-Ag Surface Activated Bonding |
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| المؤلفون: | Cai, Yuanhao, Takeuchi, Kai, Uomoto, Miyuki, Shimatsu, Takehito, Higurashi, Eiji |
| المصدر: | 2024 International Conference on Electronics Packaging (ICEP) Electronics Packaging (ICEP), 2024 International Conference on. :117-118 Apr, 2024 |
| Relation: | 2024 International Conference on Electronics Packaging (ICEP) |
| قاعدة البيانات: | IEEE Xplore Digital Library |
| ردمك: | 9784991191176 |
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| DOI: | 10.23919/ICEP61562.2024.10535599 |