مؤتمر
3.5D Advanced Packaging Enabling Heterogenous Integration of HPC and AI Accelerators
العنوان: | 3.5D Advanced Packaging Enabling Heterogenous Integration of HPC and AI Accelerators |
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المؤلفون: | Mandalapu, Chandra Sekhar, Buch, Chintan, Shah, Priyal, Topacio, Roden, Cheng, Patrick, Wang, Liwei, Swaminathan, Raja, Smith, Alan, Wuu, John, Mysore, Kaushik, Alam, Arsalan |
المصدر: | 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2024 IEEE 74th. :798-802 May, 2024 |
Relation: | 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) |
قاعدة البيانات: | IEEE Xplore Digital Library |
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