التفاصيل البيبلوغرافية
العنوان: |
Observation of Thermal Expansion Behavior of Nanotwinned-Cu/SiO2 & Regular-Cu/SiO2 Hybrid Structure via In-Situ Heating AFM |
المؤلفون: |
Lin, Huai-En, Chiu, Wei-Lan, Chang, Hsiang-Hung, Chen, Chih |
المصدر: |
2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2024 IEEE 74th. :816-820 May, 2024 |
Relation: |
2024 IEEE 74th Electronic Components and Technology Conference (ECTC) |
قاعدة البيانات: |
IEEE Xplore Digital Library |