Low-Temperature Cu-Cu Bonding Using -oriented and Nanocrystalline Hybrid Surface Grains

التفاصيل البيبلوغرافية
العنوان:	Low-Temperature Cu-Cu Bonding Using -oriented and Nanocrystalline Hybrid Surface Grains
المؤلفون:	Li, Chen-Ning, Ong, Jia-Juen, Chiu, Wei-Lan, Yang, Shih-Chi, Chang, Hsiang-Hung, Chen, Chih
المصدر:	2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2024 IEEE 74th. :1312-1316 May, 2024
Relation:	2024 IEEE 74th Electronic Components and Technology Conference (ECTC)
قاعدة البيانات:	IEEE Xplore Digital Library