An Advanced Packaging Figure of Merit (AP-FoM) for Benchmarking of Heterogeneous Integration Technologies

التفاصيل البيبلوغرافية
العنوان:	An Advanced Packaging Figure of Merit (AP-FoM) for Benchmarking of Heterogeneous Integration Technologies
المؤلفون:	Wang, Chuei-Tang, Shang, Shu-An, Hsiao, Yu-Ming, Lii, Mirng-Ji, Lee, Kam Heng, He, Jun
المصدر:	2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2024 IEEE 74th. :1093-1097 May, 2024
Relation:	2024 IEEE 74th Electronic Components and Technology Conference (ECTC)
قاعدة البيانات:	IEEE Xplore Digital Library