Finite Element Modeling for Wafer-to-Wafer Direct Bonding Behaviors and Alignment Prediction

التفاصيل البيبلوغرافية
العنوان:	Finite Element Modeling for Wafer-to-Wafer Direct Bonding Behaviors and Alignment Prediction
المؤلفون:	Baek, Kyungmin, Han, Min-soo, Han, Il Young, Shin Lee, Jung, Sim, Jaeuk, Lee, Joongha, Min, Daeho, Lim, Kyeongbin, Rhee, Minwoo Daniel
المصدر:	2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2024 IEEE 74th. :1256-1259 May, 2024
Relation:	2024 IEEE 74th Electronic Components and Technology Conference (ECTC)
قاعدة البيانات:	IEEE Xplore Digital Library