التفاصيل البيبلوغرافية
| العنوان: |
Aluminum to copper thermal compression bonding for heterogeneous integration of legacy dielets |
| المؤلفون: |
Sahoo, Krutikesh, Harish, Vineeth, Liu, Jui-Han, Irwin, Randall, Yang, Cheng-Ting Michael, Sun, Henry, Iyer, Subramanian S. |
| المصدر: |
2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2024 IEEE 74th. :1940-1946 May, 2024 |
| Relation: |
2024 IEEE 74th Electronic Components and Technology Conference (ECTC) |
| قاعدة البيانات: |
IEEE Xplore Digital Library |
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