التفاصيل البيبلوغرافية
| العنوان: |
Simulation and Metrological Applications for RDL Patterning Development of Glass Substrate |
| المؤلفون: |
Lee, Chang-Chun, Chuang, Jui-Chang, Yang, Chen-Tsai, Li, Chung-I-I, Lee, Shih-Hsien, Kuo, Shih-Hao |
| المصدر: |
2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2024 IEEE 74th. :990-995 May, 2024 |
| Relation: |
2024 IEEE 74th Electronic Components and Technology Conference (ECTC) |
| قاعدة البيانات: |
IEEE Xplore Digital Library |
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