مؤتمر
Collective die-to-wafer assembly process for optically interconnected System-on-wafer
العنوان: | Collective die-to-wafer assembly process for optically interconnected System-on-wafer |
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المؤلفون: | Kennes, Koen, Dvoretskii, Anton, Podpod, Arnita, Xu, Pengfei, He, Junwen, Lepage, Guy, Golshani, Negin, Verheyen, Peter, Magdziak, Rafal, Bipul, Swetanshu, Phommahaxay, Alain, Chakrabarti, Maumita, Miller, Andy, Beyne, Eric, Ban, Yoojin, Ferraro, Filippo, van Campenhout, Joris |
المصدر: | 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2024 IEEE 74th. :1392-1397 May, 2024 |
Relation: | 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) |
قاعدة البيانات: | IEEE Xplore Digital Library |
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