Direct Die-to-Wafer Hybrid Bonding Using Plasma Diced Dies and Bond Pad Pitch Scaling Down to 2 µm

التفاصيل البيبلوغرافية
العنوان:	Direct Die-to-Wafer Hybrid Bonding Using Plasma Diced Dies and Bond Pad Pitch Scaling Down to 2 µm
المؤلفون:	Lin, Ye, Bex, Pieter, Kennes, Koen, Derakhshandeh, Jaber, Dhakras, Prathamesh, Suhard, Samuel, Gerets, Carine, Dewilde, Sven, Georgieva, Violeta, Jourdain, Anne, Beyer, Gerald, Beyne, Eric
المصدر:	2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2024 IEEE 74th. :40-44 May, 2024
Relation:	2024 IEEE 74th Electronic Components and Technology Conference (ECTC)
قاعدة البيانات:	IEEE Xplore Digital Library