التفاصيل البيبلوغرافية
العنوان: |
Microprinting process development enabling cost effective, high density and flexible electro-optical integration |
المؤلفون: |
Nieweglowski, Krzysztof, Weyers, David, Mistry, Akash, Bock, Karlheinz |
المصدر: |
2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2024 IEEE 74th. :1790-1796 May, 2024 |
Relation: |
2024 IEEE 74th Electronic Components and Technology Conference (ECTC) |
قاعدة البيانات: |
IEEE Xplore Digital Library |