Microprinting process development enabling cost effective, high density and flexible electro-optical integration

التفاصيل البيبلوغرافية
العنوان:	Microprinting process development enabling cost effective, high density and flexible electro-optical integration
المؤلفون:	Nieweglowski, Krzysztof, Weyers, David, Mistry, Akash, Bock, Karlheinz
المصدر:	2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2024 IEEE 74th. :1790-1796 May, 2024
Relation:	2024 IEEE 74th Electronic Components and Technology Conference (ECTC)
قاعدة البيانات:	IEEE Xplore Digital Library