مؤتمر
Analysis of the Influence of Bond Wire Aging on Junction Temperature Estimation in IGBT Modules
| العنوان: | Analysis of the Influence of Bond Wire Aging on Junction Temperature Estimation in IGBT Modules |
|---|---|
| المؤلفون: | Li, Jiayi, Sha, Yanbei, Zhou, Mingchao, Wang, Lei |
| المصدر: | 2024 IEEE 7th International Electrical and Energy Conference (CIEEC) Electrical and Energy Conference (CIEEC), 2024 IEEE 7th International. :4675-4679 May, 2024 |
| Relation: | 2024 IEEE 7th International Electrical and Energy Conference (CIEEC） |
| قاعدة البيانات: | IEEE Xplore Digital Library |
| ردمك: | 9798350359558 |
|---|---|
| DOI: | 10.1109/CIEEC60922.2024.10583390 |