مؤتمر
Digital Twin Architecture to Use for Optimizing an AoD-Printing Process
العنوان: | Digital Twin Architecture to Use for Optimizing an AoD-Printing Process |
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المؤلفون: | Pfannenstiel, Hanna, Ungerer, Martin, Sieber, Ingo |
المصدر: | 2024 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP) Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP), 2024 Symposium on. :1-5 Jun, 2024 |
Relation: | 2024 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP) |
قاعدة البيانات: | IEEE Xplore Digital Library |
ردمك: | 9798350378269 |
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تدمد: | 27681874 |
DOI: | 10.1109/DTIP62575.2024.10613180 |