التفاصيل البيبلوغرافية
| العنوان: |
Study of Multi Principal Element Solders with Low Melting Point for 3D Electronic Packaging |
| المؤلفون: |
Wang, Xuechi, Ji, Xiaoliang, Wang, Yishu, Guo, Fu, Yuan, Hao, Qi, Yu |
| المصدر: |
2024 25th International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2024 25th International Conference on. :1-4 Aug, 2024 |
| Relation: |
2024 25th International Conference on Electronic Packaging Technology (ICEPT) |
| قاعدة البيانات: |
IEEE Xplore Digital Library |
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