مؤتمر
Bubble formation during silicon wafer bonding: causes and remedies
| العنوان: | Bubble formation during silicon wafer bonding: causes and remedies |
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| المؤلفون: | Mitani, K., Lehmann, V., Gosele, U. |
| المصدر: | IEEE 4th Technical Digest on Solid-State Sensor and Actuator Workshop Solid-State Sensor and Actuator Workshop, 1990. 4th Technical Digest., IEEE. :74-77 1990 |
| Relation: | IEEE 4th Technical Digest on Solid-State Sensor and Actuator Workshop |
| قاعدة البيانات: | IEEE Xplore Digital Library |
| DOI: | 10.1109/SOLSEN.1990.109824 |
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