مؤتمر
The interface microstructure on the reliability of flip-chip laser diode bonding
| العنوان: | The interface microstructure on the reliability of flip-chip laser diode bonding |
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| المؤلفون: | Chien-Chih Liu, Yen-Kuang Lin, Mau-Phon Houng, Yeong-Her Wang |
| المصدر: | Proceedings of the 4th International Symposium on Electronic Materials and Packaging, 2002. Electronic materials and packaging Electronic Materials and Packaging, 2002. Proceedings of the 4th International Symposium on. :438-444 2002 |
| Relation: | Proceedings of the 4th International Symposium on Electronic Materials and Packaging |
| قاعدة البيانات: | IEEE Xplore Digital Library |
Full Text Finder | ردمك: | 078037682X 9780780376823 |
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| DOI: | 10.1109/EMAP.2002.1188879 |