مؤتمر
The interface microstructure on the reliability of flip-chip laser diode bonding
العنوان: | The interface microstructure on the reliability of flip-chip laser diode bonding |
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المؤلفون: | Chien-Chih Liu, Yen-Kuang Lin, Mau-Phon Houng, Yeong-Her Wang |
المصدر: | Proceedings of the 4th International Symposium on Electronic Materials and Packaging, 2002. Electronic materials and packaging Electronic Materials and Packaging, 2002. Proceedings of the 4th International Symposium on. :438-444 2002 |
Relation: | Proceedings of the 4th International Symposium on Electronic Materials and Packaging |
قاعدة البيانات: | IEEE Xplore Digital Library |
ردمك: | 078037682X 9780780376823 |
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DOI: | 10.1109/EMAP.2002.1188879 |