مؤتمر
Development of interconnect technologies for embedded organic packages
| العنوان: | Development of interconnect technologies for embedded organic packages |
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| المؤلفون: | Sunohara, M., Murayama, K., Higashi, M., Shimizu, M. |
| المصدر: | 53rd Electronic Components and Technology Conference, 2003. Proceedings. Electronic Components and Technology Conference, 2003. Proceedings. 53rd. :1484-1489 2003 |
| Relation: | 53rd Electronic Components and Technology Conference, 2003. Proceedings. |
| قاعدة البيانات: | IEEE Xplore Digital Library |
Full Text Finder | ردمك: | 0780377915 9780780377912 |
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| تدمد: | 05695503 |
| DOI: | 10.1109/ECTC.2003.1216492 |