مؤتمر
Factors affecting the interfacial adhesion between a silicon die and die attach paste of integrated circuit package
العنوان: | Factors affecting the interfacial adhesion between a silicon die and die attach paste of integrated circuit package |
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المؤلفون: | Low, E., Lim, G.H., Tan, A.C. |
المصدر: | Proceedings of the 5th Electronics Packaging Technology Conference (EPTC 2003) Electronics packaging technology Electronics Packaging Technology, 2003 5th Conference (EPTC 2003). :189-193 2003 |
Relation: | Proceedings of the 5th Electronics Packaging Technology Conference (EPTC 2003) |
قاعدة البيانات: | IEEE Xplore Digital Library |
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