مؤتمر
Modeling and simulation of printed circuit board drop test
العنوان: | Modeling and simulation of printed circuit board drop test |
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المؤلفون: | Wang, Y.Q., Low, K.H., Che, F.X., Pang, H.L.J., Yeo, S.P. |
المصدر: | Proceedings of the 5th Electronics Packaging Technology Conference (EPTC 2003) Electronics packaging technology Electronics Packaging Technology, 2003 5th Conference (EPTC 2003). :263-268 2003 |
Relation: | Proceedings of the 5th Electronics Packaging Technology Conference (EPTC 2003) |
قاعدة البيانات: | IEEE Xplore Digital Library |
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