مؤتمر
Effects of anisotropic conductive adhesive (ACA) material properties on package reliability performance [flip-chip interconnects]
| العنوان: | Effects of anisotropic conductive adhesive (ACA) material properties on package reliability performance [flip-chip interconnects] |
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| المؤلفون: | Teo, M., Mhaisalkar, S.G., Wong, E.H., Poi-Siong Teo, Wong, C.C., Ong, K., Chin Foo Goh |
| المصدر: | Proceedings of the 5th Electronics Packaging Technology Conference (EPTC 2003) Electronics packaging technology Electronics Packaging Technology, 2003 5th Conference (EPTC 2003). :718-725 2003 |
| Relation: | Proceedings of the 5th Electronics Packaging Technology Conference (EPTC 2003) |
| قاعدة البيانات: | IEEE Xplore Digital Library |
Full Text Finder | ردمك: | 0780382056 9780780382053 |
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| DOI: | 10.1109/EPTC.2003.1271612 |