Selective and blanket tungsten interconnection and its suitability for 0.2-micron ULSI

التفاصيل البيبلوغرافية
العنوان: Selective and blanket tungsten interconnection and its suitability for 0.2-micron ULSI
المؤلفون: Ohba, T., Shirasaki, M., Misawa, N., Suzuki, T., Hara, T., Furumura, Y.
المصدر: Seventh International IEEE Conference on VLSI Multilevel Interconnection VLSI Multilevel Interconnection Conference, 1990. Proceedings., Seventh International IEEE. :226-232 1990
Relation: Seventh International IEEE Conference on VLSI Multilevel Interconnection
قاعدة البيانات: IEEE Xplore Digital Library
الوصف
DOI:10.1109/VMIC.1990.127870