مؤتمر
A fluxless flip chip bonding for VCSEL arrays using silver coated indium solder bumps
| العنوان: | A fluxless flip chip bonding for VCSEL arrays using silver coated indium solder bumps |
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| المؤلفون: | Kun-Mo Chu, Jung-Sub Lee, Han Seo Cho, Hyo-Hoon Park, Duk Young Jeon |
| المصدر: | 2004 International IEEE Conference on the Asian Green Electronics (AGEC). Proceedings of Asian green electronics Asian Green Electronics, 2004. AGEC. Proceedings of 2004 International IEEE Conference on the. :110-116 2004 |
| Relation: | Proceedings of 2004 International IEEE Conference on the Asian Green Electronics (AGEC) |
| قاعدة البيانات: | IEEE Xplore Digital Library |
Full Text Finder | ردمك: | 078038203X 9780780382039 |
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| DOI: | 10.1109/AGEC.2004.1290882 |