مؤتمر
Formation of fine pitch solder bumps on polytetrafluoroethylene printed circuit board using dry film photoresist
| العنوان: | Formation of fine pitch solder bumps on polytetrafluoroethylene printed circuit board using dry film photoresist |
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| المؤلفون: | Jung-Sub Lee, Kun-Mo Chu, Hyo-Hoon Park, Duk Young Jeon |
| المصدر: | 2004 International IEEE Conference on the Asian Green Electronics (AGEC). Proceedings of Asian green electronics Asian Green Electronics, 2004. AGEC. Proceedings of 2004 International IEEE Conference on the. :117-122 2004 |
| Relation: | Proceedings of 2004 International IEEE Conference on the Asian Green Electronics (AGEC) |
| قاعدة البيانات: | IEEE Xplore Digital Library |
Full Text Finder | ردمك: | 078038203X 9780780382039 |
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| DOI: | 10.1109/AGEC.2004.1290883 |