مؤتمر
Plausible origin of electromigration lifetime extrapolation difference between wafer level isothermal test and package level constant current test
| العنوان: | Plausible origin of electromigration lifetime extrapolation difference between wafer level isothermal test and package level constant current test |
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| المؤلفون: | Wang, C.S., Chen, M.J., Chang, W.C., Ke, W.S., Lee, C.F., Su, K.C., Chou, E.N. |
| المصدر: | Proceedings of the 11th International Symposium on the Physical and Failure Analysis of Integrated Circuits. IPFA 2004 (IEEE Cat. No.04TH8743) Physical and failure analysis of integrated circuits Physical and Failure Analysis of Integrated Circuits, 2004. IPFA 2004. Proceedings of the 11th International Symposium on the. :169-172 2004 |
| Relation: | Proceedings of the 11th International Symposium on the Physical and Failure Analysis of Integrated Circuits. IPFA 2004 |
| قاعدة البيانات: | IEEE Xplore Digital Library |
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