A self-packaged thermal flow sensor by CMOS MEMS technology

التفاصيل البيبلوغرافية
العنوان: A self-packaged thermal flow sensor by CMOS MEMS technology
المؤلفون: Dong-hui Gao, Ming Qin, Hai-yang Chen, Qing-an Huang
المصدر: Proceedings. 7th International Conference on Solid-State and Integrated Circuits Technology, 2004. Solid-state and integrated circuits technology Solid-State and Integrated Circuits Technology, 2004. Proceedings. 7th International Conference on. 3:1715-1718 vol.3 2004
Relation: 2004 7th International Conference on Solid-State and Integrated Circuits Technology Proceedings
قاعدة البيانات: IEEE Xplore Digital Library
الوصف
ردمك:078038511X
9780780385115
DOI:10.1109/ICSICT.2004.1435163