دورية أكاديمية
Study on the effects of wafer thinning and dicing on chip strength
| العنوان: | Study on the effects of wafer thinning and dicing on chip strength |
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| المؤلفون: | Chen, S., Tsai, C.Z., Wu, E., Shih, I.G., Chen, Y.N. |
| المصدر: | IEEE Transactions on Advanced Packaging IEEE Trans. Adv. Packag. Advanced Packaging, IEEE Transactions on. 29(1):149-157 Feb, 2006 |
| قاعدة البيانات: | IEEE Xplore Digital Library |
Full Text Finder | تدمد: | 15213323 15579980 |
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| DOI: | 10.1109/TADVP.2005.849552 |