مؤتمر
Stress effect on growth of IMCs at interfaces between Sn-Ag-Cu lead free solder and Cu substrate
| العنوان: | Stress effect on growth of IMCs at interfaces between Sn-Ag-Cu lead free solder and Cu substrate |
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| المؤلفون: | Ngoh, S.L., Thou, W., Pang, H.L., Spowage, A.C., Li, J. |
| المصدر: | 2005 7th Electronic Packaging Technology Conference Electronics Packaging Technology Electronic Packaging Technology Conference, 2005. EPTC 2005. Proceedings of 7th. 2:6 pp. 2005 |
| Relation: | Proceedings of 7th Electronics Packaging Technology Conference |
| قاعدة البيانات: | IEEE Xplore Digital Library |
Full Text Finder | ردمك: | 0780395786 9780780395787 |
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| DOI: | 10.1109/EPTC.2005.1614447 |