Thermal resistance measurement of LEDswith multi-chip packages

التفاصيل البيبلوغرافية
العنوان: Thermal resistance measurement of LEDswith multi-chip packages
المؤلفون: Lan Kim, Moo Whan Shin
المصدر: Twenty-Second Annual IEEE Semiconductor Thermal Measurement And Management Symposium Semiconductor Thermal Measurement and Management Symposium, 2006 IEEE Twenty-Second Annual IEEE. :186-190 2006
Relation: Twenty-Second Annual IEEE Semiconductor Thermal Measurement And Management Symposium
قاعدة البيانات: IEEE Xplore Digital Library
الوصف
ردمك:1424401534
9781424401536
تدمد:10652221
DOI:10.1109/STHERM.2006.1625226