مؤتمر
Reliability and thermal characterization of a 3-dimensional multichip module
| العنوان: | Reliability and thermal characterization of a 3-dimensional multichip module |
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| المؤلفون: | Lin, A.W., Lyons, A.M., Simpkins, P.G. |
| المصدر: | Proceedings of IEEE 43rd Electronic Components and Technology Conference (ECTC '93) Electronic components and technology Electronic Components and Technology Conference, 1993. Proceedings., 43rd. :71-79 1993 |
| Relation: | Proceedings of IEEE 43rd Electronic Components and Technology Conference (ECTC '93) |
| قاعدة البيانات: | IEEE Xplore Digital Library |
Full Text Finder | ردمك: | 0780307941 9780780307940 |
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| DOI: | 10.1109/ECTC.1993.346851 |