مؤتمر
Process Development for Heat Sink Attachment Using Thermally Conductive Liquid Adhesives
| العنوان: | Process Development for Heat Sink Attachment Using Thermally Conductive Liquid Adhesives |
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| المؤلفون: | Cho, Sang-jeon, Allen, Emily, Nguyen, Don, Chu, Quyen |
| المصدر: | Twenty-Third Annual IEEE Semiconductor Thermal Measurement and Management Symposium Semiconductor Thermal Measurement and Management Symposium, 2007. SEMI-THERM 2007. Twenty Third Annual IEEE. :112-117 Mar, 2007 |
| Relation: | Twenty-Third Annual IEEE Semiconductor Thermal Measurement and Management Symposium |
| قاعدة البيانات: | IEEE Xplore Digital Library |
Full Text Finder | ردمك: | 1424409586 9781424409587 |
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| تدمد: | 10652221 |
| DOI: | 10.1109/STHERM.2007.352396 |