مؤتمر
Sources of Creep Data Scattering of Solders in Micro-electronic Packaging
العنوان: | Sources of Creep Data Scattering of Solders in Micro-electronic Packaging |
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المؤلفون: | Yu, Jin, Shin, S. W., Kim, S.B. |
المصدر: | 2007 Proceedings 57th Electronic Components and Technology Conference Electronic Components and Technology Conference, 2007. ECTC '07. Proceedings. 57th. :1796-1801 Jun, 2007 |
Relation: | 2007 57th Electronic Components and Technology Conference |
قاعدة البيانات: | IEEE Xplore Digital Library |
ردمك: | 1424409845 9781424409846 1424409853 9781424409853 |
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تدمد: | 05695503 23775726 |
DOI: | 10.1109/ECTC.2007.374040 |