مؤتمر
Sources of Creep Data Scattering of Solders in Micro-electronic Packaging
العنوان: | Sources of Creep Data Scattering of Solders in Micro-electronic Packaging |
---|---|
المؤلفون: | Yu, Jin, Shin, S. W., Kim, S.B. |
المصدر: | 2007 Proceedings 57th Electronic Components and Technology Conference Electronic Components and Technology Conference, 2007. ECTC '07. Proceedings. 57th. :1796-1801 Jun, 2007 |
Relation: | 2007 57th Electronic Components and Technology Conference |
قاعدة البيانات: | IEEE Xplore Digital Library |
كن أول من يترك تعليقا!