مؤتمر
Sources of Creep Data Scattering of Solders in Micro-electronic Packaging
| العنوان: | Sources of Creep Data Scattering of Solders in Micro-electronic Packaging |
|---|---|
| المؤلفون: | Yu, Jin, Shin, S. W., Kim, S.B. |
| المصدر: | 2007 Proceedings 57th Electronic Components and Technology Conference Electronic Components and Technology Conference, 2007. ECTC '07. Proceedings. 57th. :1796-1801 Jun, 2007 |
| Relation: | 2007 57th Electronic Components and Technology Conference |
| قاعدة البيانات: | IEEE Xplore Digital Library |
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