دورية أكاديمية
System Design Issues for Harsh Environment Electronics Employing Metal-Backed Laminate Substrates
| العنوان: | System Design Issues for Harsh Environment Electronics Employing Metal-Backed Laminate Substrates |
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| المؤلفون: | Evans, J. L., Lall, P., Knight, R., Crain, E., Shete, T., Thompson, J. R. |
| المصدر: | IEEE Transactions on Components and Packaging Technologies IEEE Trans. Comp. Packag. Technol. Components and Packaging Technologies, IEEE Transactions on. 31(1):74-85 Mar, 2008 |
| قاعدة البيانات: | IEEE Xplore Digital Library |
Full Text Finder | تدمد: | 15213331 15579972 |
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| DOI: | 10.1109/TCAPT.2008.916792 |