مؤتمر
Defectivity Characterization of post-CMP Voiding in 32nm Cu Metallization
| العنوان: | Defectivity Characterization of post-CMP Voiding in 32nm Cu Metallization |
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| المؤلفون: | Boye, C. A., Kelly, J. J., Canaperi, D., Kini, Sumanth. B |
| المصدر: | 2008 IEEE/SEMI Advanced Semiconductor Manufacturing Conference Advanced Semiconductor Manufacturing Conference, 2008. ASMC 2008. IEEE/SEMI. :56-60 May, 2008 |
| Relation: | 2008 IEEE/SEMI Advanced Semiconductor Manufacturing Conference (ASMC) |
| قاعدة البيانات: | IEEE Xplore Digital Library |
Full Text Finder | ردمك: | 9781424419647 9781424419654 |
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| تدمد: | 10788743 23766697 |
| DOI: | 10.1109/ASMC.2008.4529008 |