مؤتمر
Advanced junction profile design scheme by low-temperature millisecond annealing and co-implant for high performance CMOS
العنوان: | Advanced junction profile design scheme by low-temperature millisecond annealing and co-implant for high performance CMOS |
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المؤلفون: | Ikeda, K., Miyashita, T., Kubo, T., Yamamoto, T., Sukegawa, T., Okabe, K., Ohta, H., Kim, Y. S., Nagai, H., Nishikawa, M., Shimamune, Y., Hatada, A., Hayami, Y., Ohkoshi, K., Tamura, N., Sukegawa, K., Kurata, H., Satoh, S., Kase, M., Sugii, T. |
المصدر: | 2008 Symposium on VLSI Technology VLSI Technology, 2008 Symposium on. :188-189 Jun, 2008 |
Relation: | 2008 Symposium on VLSI Technology |
قاعدة البيانات: | IEEE Xplore Digital Library |
ردمك: | 9781424418022 9781424418039 |
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تدمد: | 07431562 21589682 |
DOI: | 10.1109/VLSIT.2008.4588613 |