دورية أكاديمية
Temperature Profile Inside Microscale Thermoelectric Module Acquired Using Near-Infrared Thermoreflectance
| العنوان: | Temperature Profile Inside Microscale Thermoelectric Module Acquired Using Near-Infrared Thermoreflectance |
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| المؤلفون: | Singh, R., Nurnus, J., Bian, Z., Christofferson, J., Shakouri, A. |
| المصدر: | IEEE Transactions on Components and Packaging Technologies IEEE Trans. Comp. Packag. Technol. Components and Packaging Technologies, IEEE Transactions on. 32(2):447-452 Jun, 2009 |
| قاعدة البيانات: | IEEE Xplore Digital Library |
Full Text Finder | تدمد: | 15213331 15579972 |
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| DOI: | 10.1109/TCAPT.2008.2011886 |