مؤتمر
Uncertainty and reliability analysis of chip scale package subjected to Board-level Drop test
| العنوان: | Uncertainty and reliability analysis of chip scale package subjected to Board-level Drop test |
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| المؤلفون: | Masafumi Sano, Chou, Chan-Yen, Hung, Tuan-Yu, Shin-Yueh Yang, Kuo-Ning Chiang |
| المصدر: | EuroSimE 2009 - 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems Thermal, Mechanical and Multi-Physics simulation and Experiments in Microelectronics and Microsystems, 2009. EuroSimE 2009. 10th International Conference on. :1-6 Apr, 2009 |
| Relation: | 2009 10th International Conferene on Thermal, Mechanical and Multi-Physics simulation and Experiments in Microelectronics and Microsystems (EuroSimE) |
| قاعدة البيانات: | IEEE Xplore Digital Library |
Full Text Finder | ردمك: | 9781424441594 9781424441600 9781424441617 |
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| DOI: | 10.1109/ESIME.2009.4938466 |