مؤتمر
A new COF bonding technique using Sn bumps and a non-conductive adhesive (NCA) for image sensor packaging
| العنوان: | A new COF bonding technique using Sn bumps and a non-conductive adhesive (NCA) for image sensor packaging |
|---|---|
| المؤلفون: | Harr, Kyoung-Moo, Kim, Young-Min, Lim, Dae Hwan, Kim, Young-Ho, Kim, Jin-Gu, Yi, Sung |
| المصدر: | 2009 59th Electronic Components and Technology Conference Electronic Components and Technology Conference, 2009. ECTC 2009. 59th. :1475-1478 May, 2009 |
| Relation: | 2009 IEEE 59th Electronic Components and Technology Conference (ECTC 2009) |
| قاعدة البيانات: | IEEE Xplore Digital Library |
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