مؤتمر
Design and simulation of a package solution for millimeter wave MEMS switch
| العنوان: | Design and simulation of a package solution for millimeter wave MEMS switch |
|---|---|
| المؤلفون: | Yu, Wencai, Liao, Xiaoping |
| المصدر: | 2009 International Conference on Electronic Packaging Technology & High Density Packaging Electronic Packaging Technology & High Density Packaging, 2009. ICEPT-HDP '09. International Conference on. :201-204 Aug, 2009 |
| Relation: | 2009 International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP) |
| قاعدة البيانات: | IEEE Xplore Digital Library |
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