مؤتمر
A study of thermal performance for chip-in-substrate package on package
| العنوان: | A study of thermal performance for chip-in-substrate package on package |
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| المؤلفون: | Hung, Tuan-Yu, Yew, Ming-Chih, Chou, Chan-Yen, Chiang, Kuo-Ning |
| المصدر: | 2009 European Microelectronics and Packaging Conference Microelectronics and Packaging Conference, 2009. EMPC 2009. European. :1-6 Jun, 2009 |
| Relation: | 2009 European Microelectronics and Packaging Conference (EMPC) |
| قاعدة البيانات: | IEEE Xplore Digital Library |
Full Text Finder | ردمك: | 9781424447220 9780615298689 |
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