مؤتمر
Design of a 570 MHz current feedback amplifier on bonded wafer technology
| العنوان: | Design of a 570 MHz current feedback amplifier on bonded wafer technology |
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| المؤلفون: | Taewon Jung |
| المصدر: | Southcon/96 Conference Record Southcon/96 Southcon/96. Conference Record. :396-399 1996 |
| Relation: | Southcon/96 Conference Record |
| قاعدة البيانات: | IEEE Xplore Digital Library |
Full Text Finder | ردمك: | 0780332687 9780780332683 |
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| تدمد: | 10878785 |
| DOI: | 10.1109/SOUTHC.1996.535100 |