مؤتمر
Numerical Analysis on Stress and Strain in QFP Lead-Free Solder with Temperature Impact
| العنوان: | Numerical Analysis on Stress and Strain in QFP Lead-Free Solder with Temperature Impact |
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| المؤلفون: | Li, Zhi, Zhao, Mei-rong, You, Min, Lu, Wei-bin, Wang, Yun-Tao |
| المصدر: | 2009 International Conference on Energy and Environment Technology Energy and Environment Technology, 2009. ICEET '09. International Conference on. 1:214-217 Oct, 2009 |
| Relation: | 2009 International Conference on Energy and Environment Technology (ICEET) |
| قاعدة البيانات: | IEEE Xplore Digital Library |
Full Text Finder | ردمك: | 9780769538198 |
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| DOI: | 10.1109/ICEET.2009.58 |