مؤتمر
On the mechanical properties of Cu3Sn intermetallic compound through molecular dynamics simulation and nanoindentation testing
| العنوان: | On the mechanical properties of Cu3Sn intermetallic compound through molecular dynamics simulation and nanoindentation testing |
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| المؤلفون: | Wen-Hwa Chen, Hsien-Chie Cheng, Ching-Feng Yu |
| المصدر: | 2010 11th International Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE) Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE), 2010 11th International Conference on. :1-7 Apr, 2010 |
| Relation: | 2010 11th Intl. Conf. on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) |
| قاعدة البيانات: | IEEE Xplore Digital Library |
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