مؤتمر
Dielectric composite material with enhanced thermal conductivity used for electronic packaging
| العنوان: | Dielectric composite material with enhanced thermal conductivity used for electronic packaging |
|---|---|
| المؤلفون: | Hui Yu, Liangliang Li, Teruo Kido, Guannan Xi |
| المصدر: | 2010 11th International Conference on Electronic Packaging Technology & High Density Packaging Electronic Packaging Technology & High Density Packaging (ICEPT-HDP), 2010 11th International Conference on. :258-262 Aug, 2010 |
| Relation: | 2010 11th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP) |
| قاعدة البيانات: | IEEE Xplore Digital Library |
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