مؤتمر
Improving the humidity resistance of electronic packaging materials by micro-nano hierarchical structured silica
| العنوان: | Improving the humidity resistance of electronic packaging materials by micro-nano hierarchical structured silica |
|---|---|
| المؤلفون: | Guangfu Zeng, Dayong Gui, Xin Miao, Jingfeng Hao, Jianhong Liu |
| المصدر: | 2010 11th International Conference on Electronic Packaging Technology & High Density Packaging Electronic Packaging Technology & High Density Packaging (ICEPT-HDP), 2010 11th International Conference on. :170-175 Aug, 2010 |
| Relation: | 2010 11th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP) |
| قاعدة البيانات: | IEEE Xplore Digital Library |
Full Text Finder | ردمك: | 9781424481408 9781424481415 9781424481422 |
|---|---|
| DOI: | 10.1109/ICEPT.2010.5582455 |