دورية أكاديمية
Comprehensive Study of Lead-Free Reflow Process for a 3-D Flip Chip on Silicon Package
| العنوان: | Comprehensive Study of Lead-Free Reflow Process for a 3-D Flip Chip on Silicon Package |
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| المؤلفون: | Li, Z., Lee, S., Evans, J. L., Baldwin, D. F. |
| المصدر: | IEEE Transactions on Components, Packaging and Manufacturing Technology IEEE Trans. Compon., Packag. Manufact. Technol. Components, Packaging and Manufacturing Technology, IEEE Transactions on. 1(11):1856-1863 Nov, 2011 |
| قاعدة البيانات: | IEEE Xplore Digital Library |
Full Text Finder | تدمد: | 21563950 21563985 |
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| DOI: | 10.1109/TCPMT.2011.2163314 |